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PESDxS2UQ series Double ESD protection diodes in SOT663 package
Product specification Supersedes data of 2003 Dec 15 2004 Apr 27
Philips Semiconductors
Product specification
Double ESD protection diodes in SOT663 package
FEATURES * Uni-directional ESD protection of up to two lines * Max. peak pulse power: Ppp = 150 W at tp = 8/20 s * Low clamping voltage: V(CL)R = 20 V at Ipp = 15 A * Low reverse leakage current: IRM < 1 nA * ESD protection > 30 kV * IEC 61000-4-2; level 4 (ESD) * IEC 61000-4-5 (surge); Ipp = 15 A at tp = 8/20 s. APPLICATIONS * Computers and peripherals * Communication systems * Audio and video equipment * High speed data lines * Parallel ports. DESCRIPTION Uni-directional double ESD protection diodes in a SOT663 plastic package. Designed to protect up to two transmission or data lines from ElectroStatic Discharge (ESD) damage. MARKING TYPE NUMBER PESD3V3S2UQ PESD5V0S2UQ PESD12VS2UQ PESD15VS2UQ PESD24VS2UQ Note 1. * = p : made in Hong Kong. * = t : made in Malaysia. * = W : made in China. MARKING CODE(1) *E1 *E2 *E3 *E4 *E5
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PESDxS2UQ series
QUICK REFERENCE DATA SYMBOL VRWM Cd PARAMETER reverse stand-off voltage diode capacitance VR = 0 V; f = 1 MHz number of protected lines PINNING PIN 1 2 3 cathode 1 cathode 2 common anode DESCRIPTION VALUE 3.3, 5, 12, 15 and 24 UNIT V
200, 150, 38, 32 pF and 23 2
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3 1 3 2 2
001aaa732 sym022
Fig.1 Simplified outline (SOT663) and symbol.
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Philips Semiconductors
Product specification
Double ESD protection diodes in SOT663 package
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME PESD3V3S2UQ PESD5V0S2UQ PESD12VS2UQ PESD15VS2UQ PESD24VS2UQ LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL Ppp Ipp PARAMETER peak pulse power peak pulse current PESD3V3S2UQ PESD5V0S2UQ PESD12VS2UQ PESD15VS2UQ
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PESDxS2UQ series
DESCRIPTION plastic surface mounted package; 3 leads
VERSION SOT663
-
CONDITIONS 8/20 s pulse; notes 1 and 2 8/20 s pulse; notes 1 and 2 - - - - - - -
MIN.
MAX. 150 15 15 5 5 3 150 +150 +150
UNIT W A A A A A C C C
PESD24VS2UQ Tj Tamb Tstg junction temperature operating ambient temperature storage temperature
-65 -65
Notes 1. Non-repetitive current pulse 8/20 s exponential decaying waveform; see Fig.2. 2. Measured across either pins 1 and 3 or pins 2 and 3.
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Philips Semiconductors
Product specification
Double ESD protection diodes in SOT663 package
ESD maximum ratings SYMBOL ESD PARAMETER electrostatic discharge capability CONDITIONS
PESDxS2UQ series
VALUE
UNIT
IEC 61000-4-2 (contact discharge); notes 1 and 2 PESD3V3S2UQ PESD5V0S2UQ PESD12VS2UQ PESD15VS2UQ PESD24VS2UQ HBM MIL-Std 883 PESDxS2UQ series 10 kV 30 30 30 30 23 kV kV kV kV kV
Notes 1. Device stressed with ten non-repetitive ElectroStatic Discharge (ESD) pulses; see Fig.3. 2. Measured across either pins 1 and 3 or pins 2 and 3. ESD standards compliance ESD STANDARD IEC 61000-4-2; level 4 (ESD); see Fig.3
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CONDITIONS >15 kV (air); > 8 kV (contact) >4 kV
HBM MIL-Std 883; class 3
001aaa191
handbook, halfpage
120
MLE218
Ipp 100 % 90 %
Ipp (%)
100 % Ipp; 8 s
80
e-t 50 % Ipp; 20 s
40
10 %
0 0 10 20 30 t (s) 40
tr = 0.7 to 1 ns 30 ns 60 ns
t
Fig.2
8/20 s pulse waveform according to IEC 61000-4-5.
Fig.3
ElectroStatic Discharge (ESD) pulse waveform according to IEC 61000-4-2.
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Philips Semiconductors
Product specification
Double ESD protection diodes in SOT663 package
ELECTRICAL CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL VRWM PARAMETER reverse stand-off voltage PESD3V3S2UQ PESD5V0S2UQ PESD12VS2UQ PESD15VS2UQ PESD24VS2UQ IRM reverse leakage current PESD3V3S2UQ PESD5V0S2UQ PESD12VS2UQ PESD15VS2UQ PESD24VS2UQ VBR breakdown voltage PESD3V3S2UQ PESD5V0S2UQ PESD12VS2UQ
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PESDxS2UQ series
CONDITIONS - - - - - VRWM = 3.3 V VRWM = 5 V VRWM = 12 V VRWM = 15 V VRWM = 24 V IZ = 5 mA - - - - -
MIN. - - - - -
TYP.
MAX. 3.3 5 12 15 24 3 300 30 50 50 6.0 7.2 15.3 18.4 27.5 275 215 100 70 50 8 20 9 20 19 35 23 40 36 70
UNIT V V V V V A nA nA nA nA V V V V V pF pF pF pF pF V V V V V V V V V V
0.55 50 <1 <1 <1 5.6 6.8 15.0 18.0 27.0 200 150 38 32 23 - - - - - - - - - -
5.2 6.4 14.7 17.6 26.5 f = 1 MHz; VR = 0 V - - - - - notes 1 and 2 Ipp = 1 A Ipp = 15 A Ipp = 1 A Ipp = 15 A Ipp = 1 A Ipp = 5 A Ipp = 1 A Ipp = 5 A Ipp = 1 A Ipp = 3 A - - - - - - - - - -
PESD15VS2UQ PESD24VS2UQ Cd diode capacitance PESD3V3S2UQ PESD5V0S2UQ PESD12VS2UQ PESD15VS2UQ PESD24VS2UQ V(CL)R clamping voltage PESD3V3S2UQ PESD5V0S2UQ PESD12VS2UQ PESD15VS2UQ PESD24VS2UQ
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Philips Semiconductors
Product specification
Double ESD protection diodes in SOT663 package
SYMBOL Rdiff PARAMETER differential resistance PESD3V3S2UQ PESD5V0S2UQ PESD12VS2UQ PESD15VS2UQ PESD24VS2UQ Notes 1. Non-repetitive current pulse 8/20 s exponential decay waveform; see Fig.2. 2. Measured either across pins 1 and 3 or pins 2 and 3. GRAPHICAL DATA IR = 5 mA IR = 5 mA IR = 5 mA IR = 1 mA IR = 0.5 mA - - - - - CONDITIONS
PESDxS2UQ series
MIN. - - - - -
TYP.
MAX. 40 15 15 225 300
UNIT
104 Ppp (W)
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001aaa726
1.2 Ppp Ppp(25C) 0.8
001aaa193
103
102
0.4
10 1 10
102 tp (s)
103
0 0 50 100 150 Tj (C) 200
Tamb = 25 C. tp = 8/20 s exponential decaying waveform; see Fig.2.
Fig.5 Fig.4 Peak pulse power dissipation as a function of pulse time; typical values.
Relative variation of peak pulse power as a function of junction temperature; typical values.
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Philips Semiconductors
Product specification
Double ESD protection diodes in SOT663 package
PESDxS2UQ series
240 Cd (pF) 200
001aaa727
50 Cd (pF) 40
001aaa728
160
(1)
30
120
(2)
20
(1) (2)
80
10
(3)
40 0 1 2 3 4 VR (V) 5
0 0 5 10 15 20 VR (V) 25
(1) PESD3V3S2UQ; VRWM = 3.3 V. (2) PESD5V0S2UQ; VRWM = 5 V. Tamb = 25 C; f = 1 MHz.
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(1) PESD12VS2UQ; VRWM = 12 V. (2) PESD15VS2UQ; VRWM = 15 V. (3) PESD24VS2UQ; VRWM = 24 V. Tamb = 25 C; f = 1 MHz.
Fig.6
Diode capacitance as a function of reverse voltage; typical values.
Fig.7
Diode capacitance as a function of reverse voltage; typical values.
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Philips Semiconductors
Product specification
Double ESD protection diodes in SOT663 package
PESDxS2UQ series
10
001aaa729
IR IR(25C)
(1) (2)
1
10-1 -100
-50
0
50
100 Tj (C)
150
(1) PESD3V3S2UQ; VRWM = 3.3 V. (2) PESD5V0S2UQ; VRWM = 5 V. IR is less than 15 nA at 150 C for: PESD12VS2UQ; VRWM = 12 V. PESD15VS2UQ; VRWM = 15 V. PESD24VS2UQ; VRWM = 24 V.
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Fig.8
Relative variation of reverse leakage current as a function of junction temperature; typical values.
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Philips Semiconductors
Product specification
Double ESD protection diodes in SOT663 package
PESDxS2UQ series
ESD TESTER RZ
450
RG 223/U 50 coax
10x ATTENUATOR
4 GHz DIGITAL OSCILLOSCOPE 50
CZ note 1
Note 1: IEC61000-4-2 network CZ = 150 pF; RZ = 330 D.U.T.: PESDxS2UQ
vertical scale = 200 V/div horizontal scale = 50 ns/div
vertical scale = 20 V/div horizontal scale = 50 ns/div PESD24VS2UQ GND PESD15VS2UQ
GND
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GND
PESD12VS2UQ
GND GND GND unclamped +1 kV ESD voltage waveform (IEC61000-4-2 network)
PESD5V2S2UQ
PESD3V3S2UQ clamped +1 kV ESD voltage waveform (IEC61000-4-2 network)
GND
GND
vertical scale = 200 V/div horizontal scale = 50 ns/div unclamped -1 kV ESD voltage waveform (IEC61000-4-2 network)
vertical scale = 10 V/div horizontal scale = 50 ns/div clamped -1 kV ESD voltage waveform (IEC61000-4-2 network)
001aaa731
Fig.9 ESD clamping test set-up and waveforms.
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Philips Semiconductors
Product specification
Double ESD protection diodes in SOT663 package
APPLICATION INFORMATION
PESDxS2UQ series
The PESDxS2UQ series is designed for uni-directional protection for up to two data lines against damage caused by ElectroStatic Discharge (ESD) and surge pulses. The PESDxS2UQ series may be used on lines where the signal polarities are below ground. PESDxS2UQ series provide a surge capability of up to 150 W (Ppp) per line for an 8/20 s waveform.
line 1 to be protected line 2 to be protected
line 1 to be protected
PESDxS2UQ ground
PESDxS2UQ ground
uni-directional protection of two lines
bi-directional protection of one line
001aaa730
Fig.10 Typical application: ESD protection of data lines.
Circuit board layout and protection device placement
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Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The following guidelines are recommended: * Place the PESDxS2UQ as close as possible to the input terminal or connector. * The path length between the PESDxS2UQ and the protected line should be minimized. * Keep parallel signal paths to a minimum. * Avoid running protected conductors in parallel with unprotected conductors. * Minimize all printed-circuit board conductive loops including power and ground loops. * Minimize the length of transient return paths to ground. * Avoid using shared return paths to a common ground point. * Ground planes should be used whenever possible. For multilayer printed-circuit boards use ground vias.
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Philips Semiconductors
Product specification
Double ESD protection diodes in SOT663 package
PACKAGE OUTLINE
Plastic surface mounted package; 3 leads
PESDxS2UQ series
SOT663
D
B
E
X
Y HE
3
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A
1
e1 e bp
2
wMB Lp detail X
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 0.6 0.5 bp 0.33 0.23 c 0.18 0.08 D 1.7 1.5 E 1.3 1.1 e 1.0 e1 0.5 HE 1.7 1.5 Lp 0.3 0.1 w 0.1 y 0.1
OUTLINE VERSION SOT663
REFERENCES IEC JEDEC JEITA
EUROPEAN PROJECTION
ISSUE DATE 01-12-04 02-05-21
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Philips Semiconductors
Product specification
Double ESD protection diodes in SOT663 package
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development
PESDxS2UQ series
DEFINITION This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
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DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
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(c) Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R76/02/pp13
Date of release: 2004
Apr 27
Document order number:
9397 750 13053

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